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sabrina.he@hjssmt.com

+86 15989403900

+86 15989403900

+86 15989403900

Solder Paste Printer HJP-L9

● Humanized design
● Production of backlight/lighting/Mini LED products is preferred
● Unique spray type automatic cleaning system
● High efficiency and energy saving paper wiping structure
● Unique image processing system
● Intelligent printing production mode
● Printing range: 900 * 600mm
● Overall dimensions of the machine: 1580X1530X1500mm
● The machine is equipped with automatic tinning function, automatic steel mesh hole blocking detection function, automatic dispensing function, scraper pressure feedback function, automatic MSE/SPI online function, automatic temperature and humidity control function

Content Spec
Paste area 50*50-400*340mm
Paste accuracy ±0.025mm
Repeat   positioning accuracy ±0.01mm
Machine size 1220*1375*1500mm
Weight ≈1000Kg
Air source 4.5-6
Power 220V 50/60Hz
Used for Printing solder paste   / red glue / silver paste, etc
Screen frames Min Size 737X400mm
Screen frames Max Size 1100X850mm
Screen frames Thickness 25~40mm
PCB Min Size 50X50mm
PCB Max Size 900X600mm
PCB Thickness 0.4~8mm
PCB Warpage <1%
Transport   Height 900±40mm
Transport   Direction Left-Right;Right-Left;Left-Left;Right-Right
Transport   Speed Max 1500mm/S   Programmable
Board Location Support System Magnetic Pin/Up-down   table adjusted/support block by hand
Clamping System side clamping,vacuum   nozzle
Print head Two independent motorised printheads
Squeegee Speed 6~200mm/sec
Squeegee   Pressure 0~30Kg motor control
Squeegee Angle 60°/55°/45°
Squeegee Type Stainless   steel(Standard), plastic
Stencil   Separation Speed 0.1~20mm/sec   Programmable
Cleaning   System Dry、Wet、Vacuum   (Programmable)

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