Product Category

Contact

sabrina.he@hjssmt.com

+86 15989403900

+86 15989403900

+86 15989403900

Solder Paste Printer HJP-ASE

● Humanized design
● Wide application scope and strong universality
● Unique spray type automatic cleaning system
● High efficiency and energy saving paper wiping structure
● Unique image processing system
● Intelligent printing production mode
● Printing range: 400 * 340mm/510 * 340mm
● The internationally used UVW three-axis linkage platform is adopted
● Overall dimensions of the machine: 1220X1355X1500mm
● The machine is equipped with automatic tinning function, automatic stencil hole blocking detection function, automatic dispensing function, scraper pressure feedback function, automatic MSE/SPI online function, automatic temperature and humidity control function

Content Parameter
Paste area 50*50-400*340mm
Paste accuracy ±0.025mm
Repeat   positioning accuracy ±0.01mm
Machine size 1220*1375*1500mm
Weight ≈1000Kg
Air source 4.5-6
Power 220V 50/60Hz
Used for Printing solder paste   / red glue / silver paste, etc
Screen frames Min Size 470X370mm
Screen frames Max Size 737X737mm
Screen frames Thickness 25~40mm
PCB Min Size 50X50mm
PCB Max Size 400X340mm
PCB Thickness 0.4~6mm
PCB Warpage <1%
Transport   Height 900±40mm
Transport   Direction Left-Right;Right-Left;Left-Left;Right-Right
Transport   Speed Max 1500mm/S   Programmable
Board Location Support System Magnetic Pin/Up-down   table adjusted/support block by hand
Board Location Clamping System side clamping,vacuum   nozzle
Squeegee Speed 6~200mm/sec
Squeegee   Pressure 0~15Kg motor control
Squeegee Angle 60°/55°/45°
Squeegee Type Stainless   steel(Standard), plastic
Stencil   Separation Speed 0.1~20mm/sec   Programmable
Cleaning   System Dry、Wet、Vacuum   (Programmable)

Re:Solder Paste Printer HJP-ASE

4 + 2 =