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sabrina.he@hjssmt.com

+86 15989403900

+86 15989403900

+86 15989403900

Solder Paste Printer HJP-L15

For communication board, server and 5G board high-precision full-automatic solder paste printing machine, dual platform servo drive structure is adopted. In addition to side clip and vacuum absorption, PCB fixation is perfect for solving warped and deformed PCB boards with unique flip clip function.
It is equipped with vacuum steel screen function to solve the slight offset of steel screen during printing and ensure the printing quality; The new floating scraper head adopts PID control to monitor the scraper pressure in real time.
It is equipped with large field auxiliary camera, automatic thimble swing function, automatic solder paste adding device, etc. to maximize the intelligent integration of equipment and adapt to the intelligent production of the factory.

Content Parameter
Paste area 50*50-400*340mm
Paste accuracy ±0.025mm
Repeat   positioning accuracy ±0.01mm
Machine size 1220*1375*1500mm
Weight ≈1000Kg
Air source 4.5-6
Power 220V 50/60Hz
Used for Printing solder paste   / red glue / silver paste, etc
Screen frames Min Size 1100X300mm
Screen frames Max Size 1800X750mm
Screen frames Thickness 25~40mm
PCB Min Size 80X50mm
PCB Max Size 1500X440mm
PCB Thickness 0.4~6mm
PCB Warpage <1%
Transport   Height 900±40mm
Transport   Direction Left-Right;Right-Left;Left-Left;Right-Right
Transport   Speed Max 1500mm/S   Programmable
Board Location Support System Magnetic Pin/Up-down   table adjusted/support block by hand
Board Location Clamping System side clamping
Squeegee Speed 6~200mm/sec
Squeegee   Pressure 0~15Kg Air pressure   control
Squeegee Angle 60°/55°/45°
Squeegee Type Stainless   steel(Standard), plastic
Stencil   Separation Speed 0.1~20mm/sec   Programmable
Cleaning   System Dry、Wet、Vacuum   (Programmable)

Re:Solder Paste Printer HJP-L15

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